Infineon ESD202-B1-CSP01005: Ultra-Miniature ESD Protection Diode for High-Density Circuit Design
In the relentless pursuit of miniaturization and performance in modern electronics, protecting sensitive integrated circuits (ICs) from electrostatic discharge (ESD) presents a significant challenge. The Infineon ESD202-B1-CSP01005 addresses this challenge head-on, representing a breakthrough in ultra-miniature circuit protection technology. This device is engineered specifically for the stringent space constraints of next-generation applications, from wearable technology and IoT sensors to advanced smartphones and ultra-thin laptops.
The most defining feature of the ESD202-B1-CSP01005 is its incredibly compact CSP01005 package. With dimensions of a mere 0.38 mm x 0.19 mm and a height of just 0.145 mm, it is one of the smallest ESD protection diodes available on the market. This ultra-miniature footprint allows designers to integrate robust protection directly at the point of potential ESD strikes—such as USB ports, HDMI interfaces, antenna lines, or button/switch inputs—without compromising the precious board real estate needed for other components.
Despite its minuscule size, the component delivers robust ESD protection meeting the stringent IEC 61000-4-2 standard. It can withstand ESD strikes of up to ±12 kV (air gap) and ±8 kV (contact discharge), effectively clamping transient voltages and shunting dangerous currents away from sensitive ICs. This ensures end-products achieve the necessary reliability and pass mandatory compliance tests.
Furthermore, the diode exhibits an extremely low capacitance of just 0.35 pF (typical). This is a critical parameter for protecting high-speed data lines, as it minimizes signal integrity degradation, insertion loss, and bit-error rates. This makes it an ideal solution for high-speed interfaces like USB 3.0, HDMI 2.0, and high-frequency RF antenna lines, where data integrity is paramount.
The optimized dynamic resistance ensures a low clamping voltage during an ESD event, providing a tighter voltage margin and superior protection for advanced sub-micron process semiconductors. Its integration simplifies board layout, reduces the need for additional protection circuitry, and ultimately enhances overall system reliability while potentially lowering the total bill of materials (BOM).
ICGOODFIND: The Infineon ESD202-B1-CSP01005 is a pivotal solution for modern high-density designs, masterfully combining near-invisible size with superior protective performance. Its ultra-tiny package, minimal capacitance, and high ESD robustness make it an indispensable component for ensuring the reliability and longevity of space-constrained, high-speed electronic devices.
Keywords: Ultra-Miniature, ESD Protection, High-Density Design, Low Capacitance, CSP01005 Package.
